Processore Intel Core i9-7900X 3.3Ghz BOX

Te presentamos lo último de Intel, los nuevos procesadores para los socket 2066, con hasta 18 núcleos y 36 hilos, la familia de procesadores Intel® Core™ serie X es nuestra familia más potente. Convierte tu ordenador en un estudio: produce vídeos 4K o en 360 grados asombrosos, fotos sensacionales o una música increíble. Esta es la herramienta definitiva para los videojuegos y la realidad virtual experimenta el poder de hacerlo todo.

Especificaciones:

General information

• Type CPU / Microprocessor
• Market segment Desktop
• Family Intel Core i9
• Model number i9-7900X
• Frequency 3300 MHz
• Turbo frequency 4500 MHz
• Bus speed 8 GT/s DMI
• Clock multiplier 33
• Package 2066-land Flip-Chip Land Grid Array
• Socket Socket 2066 / R4 / LGA2066

Architecture / Microarchitecture

• Microarchitecture Skylake
• Processor core Skylake-X
• Manufacturing process 0.014 micron
• Data width 64 bit
• The number of CPU cores 10
• The number of threads 20
• Floating Point Unit Integrated
• Level 1 cache size
  • 10 x 32 KB instruction caches
  • 10 x 32 KB data caches
• Level 2 cache size 10 x 1 MB caches
• Level 3 cache size 13.75 MB shared cache
• Physical memory 128 GB
• Multiprocessing Uniprocessor
• Features
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 
  • AES / Advanced Encryption Standard instructions
  • AVX / Advanced Vector Extensions
  • AVX2 / Advanced Vector Extensions 2.0
  • AVX-512 / Advanced Vector Extensions 512
  • BMI / BMI1 + BMI2 / Bit Manipulation instructions
  • F16C / 16-bit Floating-Point conversion instructions
  • FMA3 / 3-operand Fused Multiply-Add instructions
  • EM64T / Extended Memory 64 technology / Intel 64 
  • NX / XD / Execute disable bit 
  • HT / Hyper-Threading technology 
  • VT-x / Virtualization technology 
  • VT-d / Virtualization for directed I/O
  • TBT 2.0 / Turbo Boost technology 3.0 
  • Low power features Enhanced SpeedStep technology 
• Integrated peripherals / components
  • Integrated graphics None
  • Memory controller The number of controllers: 1
  • Memory channels: 4
  • Supported memory: DDR4-2666
• Other peripherals
  • Direct Media Interface 3.0
  • PCI Express 3.0 interface (44 lanes)
• Electrical / Thermal parameters
  • Thermal Design Power 140 Watt